Amit Ghosh

• Devised and implemented strategies to improve successful fab matrices: stable photo processes for all GaN and GaAs layers, reduction of reworks and scraps, yield enhancement activities
• Developed and oversaw multiple projects such as Hybrid Gate Top with nLOF, bilayer processes for P87 SCFP and new tool qualifications
• These initiatives drastically reduced department spending, boosted returns, and improved yield
• Collaborated with various teams such as integration, quality and other process modules for troubleshooting failures, and initiated new solutions for resolving short term and chronic problems

• Directed and managed applications engineering department to deliver quality resist/polymer material products for IC manufacturing foundries across the globe
• Guided and supervised numerous international projects related to new materials development for state-of-the-art applications in electronics (mobile, displays, power devices, optoelectronics, etc.) resulting in 25% revenue growth
• Traveled internationally between various European and Asian countries to interface with different partners, market technical solutions, and enhance business relationships
• Conceived and delivered custom technical solutions for user problems in a dynamic and fast-paced environment

Led complex, multiphase and high-profile engineering projects, addressed financial constraints and complicated logistics to overcome project challenges

Managed design, prototyping, and seamless volume production of MEMS products such as VOA, IR Imagers, optical switches, sensors etc.

• Some of these products were funded by and distributed to federal government institutions such as DARPA, the U.S
• Navy, the U.S
• Army, and SBIR
• Coordinated between clients, contractors and government agencies to meet and exceed standards of design, quality, timeline, and budget expectations
• Total project worth $20M

• Managed several projects related to developing and fabricating various Microsensors & MEMS devices for numerous external customers, starting from conception, prototype building, and seamless transition to manufacturing
• Supervised quality for ISO 9001:2000 compliance and certification
• Streamlined communication between departments by establishing clear channels and protocols.

• Transferred CMOS 0.18um technology from TSMC, Taiwan and improved baseline yield and quality
• Extended operational capabilities to 0.15um process technology
• Worked closely with operations, equipment, facilities and failure analysis lab to identify and troubleshoot process-related defects
• Extensive use of SPC and DOE for monitoring process and equipment performance
• Assessed manufacturability issues and established Cp/Cpk improvement program for various process parameters.

• Designed and oversaw the construction of the CMOS Fab, project cost $300 million
• Developed 0.25micron CMOS ASIC process, and was responsible for the seamless transfer to the manufacturing of 50,000 wafers per week
• Also responsible for equipment procurement and qualification
• Implemented manufacturing process control plans and reduced process variability which resulted in high quality CMOS chips for customers such as Lucent, HP, and IBM etc
• Implemented standardized work instructions, enhancing operator understanding of critical tasks and improving workflow consistency.